“Amaoe Mbga-B14 BGA Reballing Stencil tin planting table For Samsung Exynos CPU removal glue positioning plate CPU steel mesh” has been added to your cart. View cart
AMAOE IP14 18in1 PCB BGA Platform IPX-14
₹4,499.00
AMAOE IP14 18in1 PCB BGA Platform IPX-14
Categories: New Arrival, Stencil
Description
AMAOE IP14 18in1 PCB BGA Platform IPX-14 Product Name - AMAOE /IPX-14/18 in 1 middle layer tin planting platform for iPhone X11/12/13/14 series middle layer stencil Item NO. - 2163919 BGA reballing kit - Stencil, Tin planting platform Weight 1.26 kg = 2.7778 16 = 44.4452 oz Category - Phone repair tools > BGA reballing kit Tag - tin planting platform, reballing stencil, iPhone stencil, AMAOE, middle layer stencil, 18 in 1 Brand - AMAOE Creation Time - 2022-11-02
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